Printing of copper is highly advantageous and has been the industry’s ‘holy grail’ for years. PrintCB takes a unique approach to copper ink printing. Rather than implementing complex capital equipment to eliminate oxidation during printing and drying processes, novel chemistry maintains our copper particles functional throughout the entire process.
Moreover, our copper materials remain stable during the entire product life-time thanks to an in-situ coating that takes place upon drying.
Our platform is called ‘CopPair’ as all our solutions are two-components based composed of:
Rather than trying to maintain on oxygen-free environment during the entire product lifecycle, we take a different approach. Once prepared and printed, a chemical process triggered by temperature takes place during drying, resulting with a stable conductive copper layer.
Possible drying methods include hot-air, IR lamps and direct laser sintering. Our copper ink solutions are tested under extreme environmental conditions including humidity and temperature cycling to ensure our compliance with the industry’s toughest requirements.
Low temperature sintering compatible with PET and many engineering plastics
Simple processing and scalability: screen printable, hot air drying
Direct soldering of SMT components
High thermal conductivity
Water cleaning, minimizing the need for solvents
Good adhesion to many substate materials including Aluminum & Stainless Steel