oday’s electronics devices deliver more functionality, processing power at greater speeds. New semiconductors technologies have been developed enabling higher operating temperatures of up to 250°C, pushing the thermal bottleneck to packaging materials. Moreover, new applications in electro-mobility and renewable energy add enormous challenges related to size, reliability and durability.
Traditional packaging materials such as solders and Thermal Interface Materials (TIM) are reaching their limits, generating a strong demand for innovative thermal management materials.
Copper, an excellent and widely used thermal conductive metal in electronics, in its new printed form, opens new possibilities to answer industry’s most challenging requirements.
PrintCB’s Thermal Interface Materials (TIMs) copper-based solution are designed to connect power electronics packages to Aluminum and Copper heat-sinks, delivering superior thermal conductivity while remaining durable at harsh environmental conditions.